Re: gEDA-dev: Last call for input on SOW for Linux Fund....

[Robert Fitzsimons <robfitz-at-NOSPAM273k_dot_net>]

> >  but we need to develop a suitable
> > suitable interchange file format, which represents the
> > physical component;
> 
> We need a translator system that will go between any source and 
> any target in two steps.  Source to the interchange format, 
> then interchange format to target.

That's a bit more then I was thinking, but in general I would support
your expanded interchange format.  Maybe something based on the IPC-25xx
set of standards [1].


I'm a huge fan of XML and well defined XML interchange formats, I know
that some of the developers have a dislike for XML (but for my day job I
work on systems which make use of the OpenTravel [2] XML standards).
These formats can ease the process of exchanging information between
programs/systems.

The following might be a way to describe the package of a EIA-575
standard 2012 (0805 mil) resistor (note the XML needs a lot of work).

<Package Units="mm">
        <Dual Name="RC2012" Alias="0805" Height="0.50±0.15">
                <Top Count="1" VerticalPitch="2.00±0.15" PitchOffset="INSIDE">
                        <Pad Width="1.25±0.15" Length="0.40±0.25" />
                </Top>
        </Dual>
</Package>

This could then be combined with IPC-7351 rules to produce a suitable
pcb footprint.

Another idea I had was for the format to allow the entry of the 
raw JEDEC values, so the user could just copy down the values from a
datasheet like [3] and the footprint would just drop out.

Robert

1. http://webstds.ipc.org/25XXmatrix.htm
2. http://www.opentravel.org/
3. http://pdfserv.maxim-ic.com/package_dwgs/21-0136.PDF



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